JPH0536294Y2 - - Google Patents
Info
- Publication number
- JPH0536294Y2 JPH0536294Y2 JP7981287U JP7981287U JPH0536294Y2 JP H0536294 Y2 JPH0536294 Y2 JP H0536294Y2 JP 7981287 U JP7981287 U JP 7981287U JP 7981287 U JP7981287 U JP 7981287U JP H0536294 Y2 JPH0536294 Y2 JP H0536294Y2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- enamel
- lower edge
- punched plate
- punched
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims description 41
- 210000003298 dental enamel Anatomy 0.000 claims description 25
- 239000007788 liquid Substances 0.000 description 17
- 239000000126 substance Substances 0.000 description 8
- 239000010408 film Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001962 electrophoresis Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7981287U JPH0536294Y2 (en]) | 1987-05-28 | 1987-05-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7981287U JPH0536294Y2 (en]) | 1987-05-28 | 1987-05-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63188974U JPS63188974U (en]) | 1988-12-05 |
| JPH0536294Y2 true JPH0536294Y2 (en]) | 1993-09-14 |
Family
ID=30930031
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7981287U Expired - Lifetime JPH0536294Y2 (en]) | 1987-05-28 | 1987-05-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0536294Y2 (en]) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4803002B2 (ja) * | 2006-11-27 | 2011-10-26 | パナソニック電工株式会社 | 金属プリント基板 |
-
1987
- 1987-05-28 JP JP7981287U patent/JPH0536294Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63188974U (en]) | 1988-12-05 |
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